High-resolution 3D Imaging of BEoL and Advanced Packaging Structures using X-ray Microscopy

Pr Ehrenfried Zschech

Fraunhofer Institute for Ceramic Technologies and Systems KTS Dresden, Germany


ABSTRACT


Fraunhofer Institute for Ceramic Technologies and Systems KTS Dresden, Germany X-ray imaging and X-ray computed tomography (XCT) provide non-destructive characterization capabilities of metal interconnects across a range of length scales, observing features with sizes down to several 10 nanometers. In this talk, the huge potential but also today‘s limits of laboratory X-ray microscopy and nano XCT for nondestructive 3D imaging of geometry, materials and defects in TSVs, microbumps and BEoL stacks will be described. In-situ mechanical studies to visualize crack propagation in Cu/low-k interconnect stacks will be shown. Future developments in high-resolution X-ray microscopy and nano XCT will enable to investigate thicker samples using higher photon energies (> 10 keV), to reduce the measurement time and consequently the time-to-data, and to improve the spatial resolution. With tese developments, nano-XCT will become a potential technique for semiconductor industry, e.g. in physical failure analysis laboratories.