Modern Bow Management for different BEOL stacks and a wide range of pattern densities
Dr Nadine Seifarth
Offering different metal stacks and allowing a wide range of pattern densities is nowadays standard in semiconductor industry. Hence a high variety of wafer stress, resulting in different wafer warpages and bows, has to be handled by production and assembly line.
Therefore it is very important to precisely characterize wafer stress at room temperature and during heat treatment. To investigate and understand all parameters which have an influence on wafer stress is significant for later stress management. Stress management includes stress reduction by different compensation layers, and introducing limits for different parameters.